Modules Hautes technologies

images-Hybrid-SASubstrats :  Céramique couches épaisses, FR4, FR5, G10, G11,

Flex Rigide, Rogers, Flex, IMS, Pyrex...

 

Composants : CMS jusqu'à 01 005

 

Puces : Die bonding, Wire Bonding et Flip Chip

 

Glob Top

 

image-hybrid-SA-2

Photos et technologies Hybrid SA

 

Attachments:
FileDescriptionFile size
Download this file (DIEBONDING GH FLYER_FR.pdf)DIE BONDING General HybridFiche Technique285 kB
Download this file (FLIP CHIP FR.pdf)FLIP CHIP General HybridFiche Technique298 kB
Download this file (wire bonding GH_FR.pdf)WIRE BONDING General HybridFiche Technique310 kB