General Hybrid and Flex-Ability

join their technologies

The aim of HiDensity Group is to develop a reliable partnership with our customers in order to manufacture microelectronic modules and offer complete solutions for their products. We experience an increased demand for fine pitch wich can accept dice/ASIC with a technology of few microns or so. We offer complete solutions to meet this new requirement.

The rigid ceramic substrates with a high thermal performances allow tracts and resistors printing. Multlilayer rigid PCB and aluminium substrates are well known materials in production.

Today, we must propose multilayer Flex PCB and Fine Pitch in order to srengthen our evolution. This technology involves a very high understanding of the application requirements. This can be garanteed by highly qualified specialists.

More and more, conecting dice and flex becomes the right solution for Interconnection Modules. The customer needs to be offered a complete solution by a single supplier which can deal with dice design, dice and flex PCB puchase, as well as dice assembly.

Flex-Ability has well understood the advantage of this mergin technologies. Flex-Ability is now part of the HiDensity Group becoming a shareholder of General Hybrid S.A.

Our objective is to satisfy our customers with:
Design Center and Control of foundry through HMT
Circuit Design and dice bonding with direct bondebility and microbump arrays or COB, IC, and wafer assembly through HYBRID SA.
Flex Circuit manufacture taking into account design and dice assembly requirement.

General Hybrid is now in position to offer the complete solution of the

HIGH DENSITY FLEX CIRCUIT.