20 years of experience
in the development of thick film hybrid, Hybrid SA, Swiss company joined the Hi Density group in 1993.

The speciality of Hybrid SA is to produce your application in a minimum amount of space with the highest degree of reliability.

High annual amount of investment in production rooms and manufacturing equipment allow reliable automated processes. SMD pick and place machines, automatic high precision die bonder, fast automatic wire bonders give quick production cycles at industrial costs.

Modules mix miniaturisation technologies such as Chip on Board, Flip-Chip, TAB to give MCM’s. Their package is also adapted to customized demand like BGA.